Area Selective Deposition Workshop 2027 will provide an international forum for researchers from academia, industry, and national laboratories to discuss advances in area-selective deposition and related selective processing. The workshop will focus on the surface chemistry, nucleation control, inhibition, activation, selective etching, metrology, modeling, and integration strategies needed to enable bottom-up fabrication for Ångström-era semiconductor manufacturing and emerging nanoscale technologies.

Building on the tradition of previous ASD workshops, the program will feature tutorials, invited and contributed talks, poster sessions, and focused discussions designed to promote exchange across disciplines and career stages, connecting early-career researchers, established scientists, equipment suppliers, materials providers, and device manufacturers.

ALD for Industry 2027, the 10th edition of this international conference organized by EFDS (European Society of Thin Films), brings together researchers, industry experts, and exhibitors working on atomic layer deposition (ALD), a vapor-phase process for depositing thin film materials, to bridge fundamental science with industrialization and commercialization. It takes place March 16–17, 2027, in Dresden, Germany, featuring conference presentations, an exhibition, and tutorials covering ALD process developments, coatings, precursor materials, and applications in semiconductors, sensors, and energy technologies. Held annually since 2016 and drawing over 100 participants, the event offers a chance to present research, explore new equipment and materials, and network with academic and industrial partners in the field.

Featuring Presentations on Emerging Topics Related to Materials, Processing & Interfaces

• The AVS International Symposium and Exhibition addresses cutting edge issues associated with materials, processing and interfaces in both the research and manufacturing communities.
• The weeklong Symposium fosters a multidisciplinary environment that cuts across traditional boundaries between disciplines, featuring papers from AVS Technical Division, Groups, Focus Topics on emerging technologies and more.
• An extensive Exhibition of related equipment, tools, materials, supplies, chemicals, services, consulting, technical literature, and new technologies are showcased during the week.

The AVS International Symposium and Exhibition is one of the largest in the world and provides an excellent opportunity for AVS attendees and members to view the latest and greatest cutting-edge products and services offered by over 200 participating companies to the research and manufacturing communities associated with vacuum science and technology.

AP-ALD 2026 is the second International Asia Pacific Atomic Layer Deposition Conference, bringing together researchers, industry professionals, and academic leaders to discuss the latest advances in Atomic Layer Deposition (ALD). Held at the Grand Hyatt Jeju, Korea, the conference will feature sessions on ALD fundamentals, process technologies, Atomic Layer Etching (ALE), and emerging applications in next-generation semiconductors, displays, and energy devices. AP-ALD 2026 provides a valuable platform for collaboration and knowledge exchange across the Asia-Pacific ALD community.

Join us in Calgary, Canada, October 25–29, 2026, for the 250th ECS Meeting—a historic celebration of science, innovation, and community. 

This fall, the 250th ECS Meeting will be held on Oct. 25-29, 2026 in Calgary (Canada), and is expected to gather over 3,000 participants
and 40 exhibitors from both academia and industry.
The conference has a strong focus on emerging technology and applications in both solid-state science & technology and electrochemistry.
● General information and the Meeting Program can be found here: Important Information and Call for Papers
● For more information about our annual symposium G01 and the conference website: Meeting Information

The organizers of symposium G01 on “Atomic Layer Deposition & Etching Applications, 22” encourage you to submit your abstract(s) on
topics comprising but not limited to:
        1.   Semiconductor CMOS applications: development and integration of ALD high-k oxides and metal electrodes with conventional and high-mobility channel materials;
2.   Volatile and non-volatile memory applications: extendibility, Flash, MIM, MIS, RF capacitors, etc.;
3.   Interconnects and contacts: integration of ALD films with Cu and low-k materials;
4.   Fundamentals of ALD processing: reaction mechanisms, in-situ measurement, modeling, theory;
5.   New precursors, delivery systems & sustainability issues;
6.   Optical, photonic and quantum applications; applications aiming at Machine Learning, Artificial Intelligence;
7.   Coating of nanoporous materials by ALD;
8.   Molecular Layer Deposition (MLD), hybrid ALD/MLD; Vapor Phase Impregnation (VPI) and Sequential Infiltration Synthesis (SIS);
9.   ALD for energy conversion applications such as fuel cells, photovoltaics, etc.;
10. ALD for energy storage applications;
11. Productivity enhancement, scale-up and commercialization of ALD equipment and processes for rigid and flexible substrates, including roll-to-roll and spatial processing;
12. Area-selective ALD;
13. Atomic Layer Etching (‘reverse ALD’) and related topics aiming at self-limited etching, such as atomic layer cleaning, etc.

FYI: Last year at the 248th Meeting in Chicago, our symposium G01 on ALD & ALE Applications 21 attracted some 80 participants,
attending a full 4-days schedule with 64 presentations (12 invited ; 45 contributing and ~7 posters). We expect to be at least as successful this Fall in Calgary.
submission instructions

In order to receive a Visa letter of invitation on ECS letterhead via email, please fill out the form:

Visa Letter Request - Electrochemical Society

For (limited) general travel grant questions, please contact travelgrant@electrochem.org.

As in the past years, we expect also our symposium to be able provide some partial travel allowance to selected speakers.

LIST OF CONFIRMED INVITED SPEAKERS

1. Harmeet Singh, Lam Research, USA – KEYNOTE: ALD and selective isotropic etch / ALE for advanced logic and memory

2. Rong Chen, Huazhong Univ. of Sc. & Techn., China - Selective ALD: Enabling Atomic-Scale Manufacturing for Next-Generation Devices

3. Yang Zhao, Univ. of Western Ontario, Canada -Interface Understanding and Engineering for Next-Generation Batteries

4. Christos Takoudis, University of Illinois Chicago, USA The Future of ALD via Active Learning

5. Hae Lin Yang, Hanyang University, Korea - Inhibitors for Area-Selective Deposition

6. David Emslie, McMaster Univ., Canada - Thermal ALD of Transition Metal and Main Group Element Thin Films using Alkoxide Precursors

7. Haonan Liu, Tokyo Electron Ltd., Japan - Establishing High-Temperature Area Selective ALD Process through Surface Inhibition

8. Jane Chang, UCLA, USA - ALE in Patterning Materials: Anisotropy, Selectivity, Specificity and Sustainability

9. Cathérine Bunel, Murata, France - ALD as a key enabler for high‑density, reliable silicon capacitors in advanced packages

10. Andreas Werbrouck, Ghent University, Belgium - (Re-)discovering surface chemistry with LLM agents

11. Paul Ragogna, Western University, Canada - Molecular Layer Deposition

12. Aaron Dangerfield, Applied Materials, USA - In-situ metrology for selective deposition and various semiconductor applications

13. Cathleen Crudden, Queens University, Canada - N-heterocyclic carbenes in the modification of electroactive metals and carbons

TUTORIALS:

- Nathan Marchack, IBM, USA - Centering Sustainability in Atomic Layer Processing: Outlook and Challenges

- Heeyeop Chae, SKKU, Korea - Atomic Layer Etching: Reaction Paths and Characteristics

- Ruud van Ommen, Delft University, Netherlands - ALD on particulate materials

  Symposium organizers:

Fred Roozeboom (lead), Stefan De Gendt, Jolien Dendooven, Jeffrey Elam, Oscar van der Straten, Andrea Illiberi, Ganesh Sundaram,

Rong Chen, Oana Leonte, Thorsten Lill, Matthias Young, and Bhaskar Jyoti Bhuyan.

Beneq brings its signature ALD TechDay to Yokohama this year, alongside ICSCRM 2026 — an evening for the SiC and GaN wide-bandgap semiconductor community on how ALD is shaping next-generation power devices.

Speakers from leading power electronics manufacturing, research, and insights organizations — Yole Group, NIMS Japan (National Institute for Materials Science), Renesas Electronics Corp, and Beneq.

Industry presentations will be followed by dinner and networking — an evening to connect with peers over good food and conversation.

Places are limited — request to attend.

Exploring current and emerging frontiers in ALD, CVD, and solution-based conformal depositions. Join us on September 23rd- 24th  2026 in Bratislava.

Workshop Topics:

• Spatially defined depositions
• Coating of powders
• Solution-based depositions
• Highly reactive substrates
• Conformal 2D materials
• On the frontiers session

To celebrate the fifth anniversary of the annual ALPIN Workshop, it will return to Dresden this September. Please save the date and join us in Dresden on September 17–18. The event is planned as a two-day workshop featuring talks and poster sessions. The call for abstracts will be announced soon on the website and via email.