Event Title
24th edition of the Euro CVD & ALD conference
2025, Jun 2-5
Catania, Italy
Type of Event

Euro CVD&ALD conference will be hosted in Catania, Italy, from 2nd until 5th of June 2025. 
The Euro CVD&ALD conference wants to be the platform for all people active in the field of chemical vapor deposition techniques to describe new results, to encourage in-depth cross-functional discussions between the experts and to be a valuable learning experience for those who are new to the field or those enthusiasts who want to broaden their horizon in general. 
We hope to welcome you all in Catania!

2025, Jun 2-5
Event Title
Joint International Meeting ECS 2024
2024, Oct 6-11
Honolulu, USA
Type of Event

Every 4 years, the PRiME Joint International Meeting is held under the auspices of the Electrochemical Society (ECS), joint with its sister Societies of Japan and Korea. 

This fall, PRIME 2024 will be held on Oct. 6-11, 2024 in Honolulu, Hawaii, and is expected to gather over 4000 participants and 40 exhibitors from both academia and industry. The conference has a strong focus on emerging technology and applications in both solid-state science & technology and electrochemistry. 


The organizers of symposium G01 on “Atomic Layer Deposition & Etching Applications, 20” encourage you to submit your abstract(s) on topics, comprising but not limited to:


1.   Semiconductor CMOS applications: development and integration of ALD high-k oxides and metal electrodes with conventional and high-mobility channel materials; 

2.   Volatile and non-volatile memory applications: extendibility, Flash, MIM, MIS, RF capacitors, etc.;

3.   Interconnects and contacts: integration of ALD films with Cu and low-k materials; 

4.   Fundamentals of ALD processing: reaction mechanisms, in-situ measurement, modeling, theory; 

5.   New precursors and delivery systems; 

6.   Opticalphotonic and quantum applications; applications aiming at Machine Learning, Artificial Intelligence;

7.   Coating of nanoporous materials by ALD; 

8.   Molecular Layer Deposition (MLD) and hybrid ALD/MLD; 

9.   ALD for energy conversion applications such as fuel cells, photovoltaics, etc.; 

10. ALD for energy storage applications; 

11. Productivity enhancement, scale-up and commercialization of ALD equipment and processes for rigid and flexible substrates, including roll-to-roll deposition; 

12. Area-selective ALD; 

13. Atomic Layer Etching (‘reverse ALD’) and related topics aiming at self-limited etching, such as atomic layer cleaning, etc. 


Track record: Last year in Gothenburg, our symposium G01 on ALD & ALE Applications 19 attracted a record number of 78 presentations, composing a full 4-day schedule of 66 oral (of which 18 invited), 

plus 12 poster presentations.   

In Hawaii, we will traditionally attract more attendants from the Far East, and we expect to be as successful this fall in Honolulu. 


Abstract submission 

Meeting abstracts should be submitted not later than the deadline of April 12, 2024 via the ECS website: Submission Instructions.

2024, Oct 6-11
Event Title
ALPIN Workshop 2024
2024, Sep 24-25
Jena, Germany
Type of Event
Seminar / Workshop / Class

Dear ALP-Community,

This year’s ALPIN workshop will take place from 24.09. to 25.09.2024 in Jena. For a better planning we have prepared a registration form. We would like to ask all ALPIN members and interested parties to register. Deadline for registration is 30.06.2024.

2024, Sep 24-25
Event Title
ALD/ALE 2024
2024, Aug 5-7
Helsinki, finland
Type of Event

The AVS 24th International Conference on Atomic Layer Deposition (ALD 2024) featuring the 11th International Atomic Layer Etching Workshop (ALE 2024) will be a three-day meeting dedicated to the science and technology of atomic layer controlled deposition of thin films and atomic layer etching.  Since 2001, the ALD conference has been held alternately in the United States, Europe and Asia, allowing fruitful exchange of ideas, know-how and practices between scientists. The conference will take place Sunday, August 4-Wednesday, August 7, 2024, at the Messukeskus in Helsinki, Finland.

As in past conferences, the meeting will be preceded (Sunday, August 4) by one day of tutorials and perspectives and a welcome reception. Sessions will take place (Monday-Wednesday, August 5-7) along with an industry tradeshow. All presentations will be audio-recorded and provided to attendees following the conference (posters will be included as PDFs). Anticipated attendance is 700+. 

ALD Invited Speakers
Cheol Ho Choi (Kyungpook National University,  South Korea)
Mariadriana Creatore (TU Eindhoven, The Netherlands)
Cathleen Crudden (Queen’s University, Canada)
Myung Mo Sung (Hanyang University, South Korea)
Marianna Kemell (University of Helsinki, Finland)
Jacques Kools (Encapsulix SAS, USA)
Han-Bo-Ram Lee (Incheon National University, South Korea)
Lionel Santinacci (Aix-Marseille University, France)
Uwe Schröder (Namlab, Germany)
Tamar Segal-Peretz (Technion Israel Institute of Technology, Israel)
Yukihiro Shimogaki (Tokyo University, Japan)
Mikko Söderlund (Beneq, Finland)
Ralf Tonner-Zech (Wilhelm Ostwald Institut fur Physikalische Chemistry, Leipzig, Germany)
Dave Towner (Intel Corporation, USA)
Christian Wenger (IHP-Leibniz-Institut für Innovative Mikroelektronik, Germany)

ALE Invited Speaker
Keun Hee Bai (Samsung Electronics, South Korea)
Heeyeop Chae (Sungkyunkwan University, South Korea)
Thierry Chevolleau (CEA-LETI, France)
Dimitri Kioussis (Intel Corporation, USA)
Eric Liu (Tokyo Electron America, USA)
Nathan Marchack (IBM Research, USA)

Tutorial Speakers
Stacey Bent (Stanford University, USA)
Robert Clark (TEL, USA)
Wei-Min Li (LeadMicro, China)
Thorsten Lill (Clarycon Nanotechnology Research, Inc., USA)
Charles Winter (Wayne State University, USA)

2024, Aug 5-7
linkedin invite