Product model
Infinity M500
Type of product
Manually Loaded Tool

The Encapsulix Infinity M500D is a versatile product family for extremely fast sheet-to-sheet low temperature, deposition in pilot manufacturing and advanced R&D. Typical applications are OLED (lighting and displays) , LED , photovoltaics ( Perovskite and organic PV, passivation layers on silicon PV), batteries and ultracapacitors as well as flexible electronics and advanced optical coatings. Substrate handling can be adapted easily to accommodate a variety of substrates such as Gen 2.5 FPD glass ( 400mm x 500 mm) or multisubstrate cassettes for Silicon PV cells. Substrate loading can be either manual or automated with interfacing to a robot in a glovebox. 

The Infinity product family is based on Encapsulix Parallel Precursor Wave™ (PPW) reactor architecture, which allows for extremely fast deposition, even at low temperature. For example, in the case of OLED encapsulation by Al2O3 at 80°C, the cycle time is less than one second. All tools of the family use the same core technology subsystems. Thus, process transfer between R&D on smaller substrates and manufacturing on larger substrates is smooth and hassle free.  

Modular zero-dead-volume ALD valves allow for ultrarapid change between metal precursors (less than 1 second). Hence, the tool is extremely well suited for the deposition of multilayers and nanolaminates. 

The tool is highly configurable with a large number of options ( see below).

The control system uses the Encapsulix UCS architecture, the core of which is a real time controller with state machine and OPC-UA dataserver. Recipe files are text based on an open syntax format, allowing for off-line recipe creation and remote process support. The tool has extensive real time and delayed data logging and monitoring capabilities. 

A list of scientific publications where the Encapsulix has been used can be found here.

Technical features

Typical substrate size and type
• Glass substrates up to Gen 2.5 ( 500 mm x 400 mm)
• 300 mm wafer
• 200 mm wafers in batches of 3 pcs
• Lenses and mirrors
• Precision mechanical parts

Processing temperature and capacity
• 25 – 135°C standard ; optionally up to 200 °C
• Up to 5 Gen 2.5 ( 400mmx 500 mm) glass substrates per hour ( 50 nm Al2O3 OLED encapsulation at 80 °C) 

Typical processes
• High deposition rate at low temperature process

         TMA + H2O at 80 ° C : > 7 nm/min

        TMA + Ar/O2 plasma at 65°C.: > 10 nm/min
• Typical materials : Al2O3, ZnO, SnO2, TiO2, SiO2, …
• Proven ultrabarrier performance ( used for OLED encapsulation in manufacturing) 

Substrate loading
• Air to Air system with manual or automatic substrate loading
• Interfacing with factory automation 

Key software features
• Stand alone recipe editor enabling offline recipe creation and modification
• Data logging
• Integration with factory automation and database

• Up to 5 metal precursors, 6 gas lines, 4 oxidant sources 
• Ozone system as an option
• Electrode for Plasma ALD as an option
• Field Swappable Sources for upgrade and retooling
• Heating ( 3 zones per line) or cooling ( Peltier element)
• Individual Capacitance Pressure Gauge for each source 
• Level sensors

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