Manufacturer
Beneq
Product model
Transform 200
Type of product
200 mm single wafer plasma ALD & 200 mm batch thermal ALD cluster system
Description

Thermal and Plasma ALD systems connected in one cluster system. Single wafer or batch processing. Widest range of high-performance oxides and nitrides. Maximize your options for flexible volume production. With its flexible automation platform and unique capability to combine both thermal batch and plasma enhanced ALD process modules in one integrated system, Beneq Transform® offers unparalleled flexibility in how processing sequences can be realized to meet the most demanding thin-film deposition requirements.

Beneq Transform® establishes a completely new class of ALD cluster tool products in it’s versatility and adaptability to address a broad range of applications and market segments. The Beneq Transform® is a one-stop ALD solution for Power Electronics, MEMS and Sensors, RF, LED, Photonics, and Advanced Packaging applications and other More than Moore applications. 

Beneq Transform® configured with multiple ALD process modules to meet a specific wafer capacity requirement or be later upgraded in response to growing volumes or with new ALD applications.

The Transform 200 cluster consists of:

  • Brooks transfer module
  • 200 mm thermal batch ALD reactor
  • 2 units of 200 mm single wafer plasma ALD reactors
  • Batch wafer heater module
  • Brooks transfer module

The Transform 200 Lite cluster consists of:

  • Brooks transfer module
  • 200 mm thermal batch ALD reactor
  • 200 mm single wafer reactor
  • Batch wafer heater module
  • Brooks transfer module

Additional content

  • Brochure of the Transform can be found here.
  • Additional video about the Transform can be found here.
  • Atomic Layer Deposition (ALD) equipment percolates into serial production of More-than-Moore devices, a conversation  with Yole Développement.

 

Technical features

Maximum Configuration

3 ALD modules + pre-heater

Transfer Module

Brooks Mx600SS

Cooling Option

Built-in

VCE Loadlocks

2

Substrate Size

3”, 4”, 6” or 8”

Maximum Dimensions

3120x4070x2140 mm

Integration  

SECS/GEM

Throughput: Al2O3 – 300 oC – 50 nm

15 wafers/hour (1PM) >40 wafers/hour (3PM’s)

 

Product Links
Beneq Transform 200 manufacturer page
Beneq Transform 200 Video
LinkedIn
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