- Manufacturer
- Beneq
- Product model
- Transform
- Type of product
- Versatile ALD platform for More-than-Moore device manufacturing
- Description
Thermal and Plasma ALD systems connected in one cluster system. Single wafer or batch processing. Widest range of high-performance oxides and nitrides. Maximize your options for flexible volume production. With its flexible automation platform and unique capability to combine both thermal batch and plasma enhanced ALD process modules in one integrated system, Beneq Transform® offers unparalleled flexibility in how processing sequences can be realized to meet the most demanding thin-film deposition requirements.
Beneq Transform® 300 is the only 300 mm ALD cluster tool combining thermal ALD (batch) and plasma ALD (single wafer) technologies to provide a highly versatile solution to IDMs and foundries. Transform® 300 is dedicated to a broad range of advanced thin-film applications from gate dielectric to anti-reflection coating, final passivation or encapsulation and beyond.
Transform 300 consists of:
- 2 units of single 300 mm wafer plasma ALD reactor
- Batch 300 mm wafer thermal ALD reactor
- Batch 300 mm wafer preheater module
- Brooks transfer module
Additional content
- Technical features
Specifications:
Maximum Configuration
3 processing modules & 1 preheater
Dimensions
4400 x 4800 x 2250 mm
Host Integration
SECS/GEM
Batch Size
Up to 25 x 300 mm wafers
Single Wafer Substrates
300 mm with 200 mm bridge capability
Safety Standards
SEMI S2 and S8
ALD Processes
Al2O3, SiO2, HfO2, Ta2O5, TiO2, AlN, TiN, ZnO, Si3N4
Processing Temperature
420 °C (batch) 350 C (plasma)
Throughput: Al2O3 – 300 oC – 50 nm
12 wafers/hour – 1 batch PM
- Product Links
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Beneq Transform manufacturer pageBeneq Transform Video
