Manufacturer
Beneq
Product model
TFS 200
Type of product
R&D wafer, 3D and powder coating tool
Description

ALD research equipment that grows with you. Beneq TFS 200 is the most flexible ALD research platform ever designed for academic research and corporate R&D. Beneq TFS 200 has specifically been designed to minimize any cross contamination that could happen in a multi-user research environment. The large number of available options and upgrades means that your Beneq TFS 200 will grow with you to meet even the most demanding research requirements. Beneq TFS 200 represents technical solutions that enable deposition of superior quality coatings on wafers, planar objects, porous bulk materials and complex 3D objects with very high aspect ratio (HAR) features. Direct and remote plasma-enhanced deposition (PEALD) is available in Beneq TFS 200 as a standard option. The plasma is capacitively-coupled (CCP), which is the industry standard today. The CCP plasma option offers both direct and remote plasma-enhanced ALD (PEALD) for substrates up to 200mm, face-up or face-down.

Process cycle time customarily less than 2 seconds. In specific cases even less than 1 second
High Aspect Ratio (HAR) available for structures with vias and porous substrates
Cold-wall vacuum chamber for rapid heating and cooling
Auxiliary entry ports in vacuum chamber enable plasma, in situ diagnostics etc.
Load lock available for rapid substrate change and integration with other equipment.

A list of open acces scientific publications where the Beneq TFS 200 has been used can be found here.

Technical features

Process type 

  • Thermal ALD
  • Plasma enhanced ALD
  • Face-up and face-down 

Usage 

  • R&D 

Substrate type 

  • Up to 200 mm wafer
  • Up to 200 x 200 mm 3D parts
  • Powder 

Substrate loading 

  • Automatic
  • Manual 

Main dimensions 

  • 1325 x 600 x 1298 mm 

Integration 

  • Glove box
  • Load-lock
  • Cluster 

Substrate temperature range

  • 25 – 500 °C 

Reaction chamber types and dimensions 

  • Single wafer: ø200 × 18 (mm)
  • Single wafer plasma: ø200 × 18 (mm
  • 3D/batch of wafer: ø200 × 95 (mm)
  • Customized: by request 

Gas lines 

  • Up to 8 

Liquid sources (+5 °C to ambient) 

  • Up to 4 

Hot sources HS 300 (ambient to 300 °C) 

  • Up to 4 

Hot sources HS 500 (ambient to 500 °C) 

  • Up to 2 

Plasma option (PEALD) 

  • Power: 300 W
  • Type: capacitively coupled plasma (CCP) 

Ozone

  • Ozone cabinet option

Fluidized bed particle coating option 

  • Particle size (min.)1: 100 nm – 1 µm
  • Sample volume (max.): 50 – 75 cm3
  • Temperature (max.)2: 450 °C 
  • See video of fluidized bed in action

Control system 

  • PLC control with PC user interface 

Main dimensions, ALD system (L × W × H) 

  • 1325 × 600 × 1298 (mm) 

Main dimensions, electric cabinet (L × W × H) 

  • 1000 × 300 × 1600 (mm)

Additional content

  • Brochure of the TFS-200 can be found here.
  • Additional video about the TFS-200 can be found here.
Product Links
Beneq TFS 200 manufacturer page
Beneq TFS 200 Video
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