ATLANT 3D Nanosystems
Product model
Type of product
Direct patterned ALD coating system using micronozzle

ATLANT 3D's technology involves the sequential deposition of gases for direct patterning of various coating materials. It uses a micronozzle that sequentially ejects reactive vapors over a moving substrate. So far the following materials have been tested: TiO2, Pt, ZnO, SiO2.

Discover the most versatile & powerful tool ever created to accelerate advanced material innovation, rapid process testing & device development with atomic precision.​​ Experience the unprecedented flexibility & material versatility!

We enable on-demand next-generation microdevices printing on simple and complex surfaces atom-by-atom. The NANOFABRICATOR™ LITE is the most compact tool ever created to accelerate materials, processes and device innovation with atomic precision. It is suitable for a wide range of applications such as MEMS, devices, optics, photonics, packaging, RF & electronics and quantum devices which can be developed with ATLANT 3D technology with previously impossible functionality and speed at a fraction of a cost.

Unique ATLANT 3D's technology allows

  • Direct patterned ALD coating using micronozzle
  • Rapid atomic layer prototyping and manufacturing
  • Highly selective atomic layer patterning
  • Excellent 2D/3D conformal deposition on simple and complex surfaces
  • Combining multiple materials with excellent compatibility
  • Excellent pattern adhesion to almost any surfaces
  • Digital and atomically precise control over the printing process
  • With possibility to apply up to 450 different commercially available materials

4 different precursors and 4 different reactants can be loaded at the same time, allowing you to quickly switch between the materials you wish to deposit or test.

  • DALP®. ATLANT 3D’s Microreactor Direct Atomic Layer Processing technology offers maskless process flexibility and unparalleled prototyping speed – reducing the time of
    design iterations, resource dependencies and overall cost of innovation. 
  • Multi-material. Enabling multi-material deposition in one process, tested on a wide range of advanced materials, independent of surface roughness and substrate sensitivity with multi-shape deposition and a high degree of thickness control. 
  • NANOFABRICATOR™ LITE. Suitable for a wide range of applications such as MEMS and sensors, optics, photonics, advanced packaging, microelectronics as well
    as emerging applications. Designed as a compact and versatile tool to seamlessly integrate into your lab infrastructure.


  • LINE WIDTH: 400 µm now, 25 µm in development, 1 µm long term goal
  • TEMPERATURE: Operates in a temperature range from room temperature (RT) up to 300°C
  • PROCESS SPEED: Variable from 0.1 mm/s up to 100 mm/s (based on sample and process specifications)
  • VERSATILE MATERIALS PLATFORM: Possible to process several materials sequentially out of 150* possible.
  • ENVIRONMENT: Open atmospheric conditions or within controlled ambient environments
  • HYBRID PROCESSING: Direct additive and subtractive processing
  • SELECTIVE AREA DEPOSITION: Path-defined processing for targeted deposition of materials
  • SURFACE GEOMETRY: Conformal deposition on any type of surface with corrugation up to 25 µm
  • MULTIMATERIAL STACK PRINTING: Multiple materials can be deposited sequentially
  • CRYSTALLINE MATERIAL: Growth High quality material deposition
  • SELECTIVE NANOPARTICLE DEPOSITION: Tested with platinum (Pt) processes
  • HOLLOW MICROSTRUCTURING: Post process hollow structure development
Technical features



  • Size: up to 4″ (100mm)
  • Substrate Handling​: Wafer
  • Maximum thickness: 10 mm
  • Z direction shape: Flat
  • Holding method: Vacuum
  • Loading: Manual
  • Heater temperature: max. 300°C
  • Heater temp. uniformity: +/- 1%

Process Chamber

  • Environment: Ambient**** Uncontrolled
  • Processing speed*: up to 200 mm/sec
  • Deposition area: up to 1.5 mm from wafer edge
  • DALP®resolution: 400 μm standard

Gas system

  • Precursor temperature: RT – 150°C
  • Nr. of precursor bubblers: 2**
  • Nr. of reactant bubblers: 1** (H2O***)
  • Nr. of gas reactants: 1**


  • Environment: Inert***** Controlled
  • Additional precursor bubblers: **
  • Additional reactant bubblers: **
  • Additional gas reactants: **

Footprint: tool size D 100 cm x H 200 cm x W 250 cm

Weight: 400 kg

Power supply 

  • 3-phase 32 A
  • 3-phase 16 A
  • 230 V, 50-60 Hz

Gas line connections

  • Argon line connection required
  • Nitrogen line connection required
  • Oxygen line connection required
  • Compressed air line connection required Vacuum line connection required

Exhaust connections

  • For electric box
  • For gas box For printing unit
  • For printhead, should be connected to absorption or decomposition filter (not provided with the system)

* Dependent on materials to be deposited and customer needs.
** Additional number of bubblers and reactants dependent on customer needs.
*** Additional reactant types dependent on customer needs.
**** Clean room, CLASS 8 min recommended.
***** Argon recommended.

Product Links
ATLANT 3D Nanosystems NANOFABRICATOR™ LITE manufacturer page
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