Discover the most versatile & powerful tool ever created to accelerate advanced material innovation, rapid process testing & device development with atomic precision.​​ Experience the unprecedented flexibility & material versatility!

We enable on-demand next-generation microdevices printing on simple and complex surfaces atom-by-atom. The NANOFABRICATOR™ LITE is the most compact tool ever created to accelerate material testing, processes and device innovation with atomic precision. It is suitable for a wide range of applications such as MEMS, devices, optics, photonics, packaging, RF & electronics and quantum devices which can be developed with ATLANT 3D technology. The NANOFABRICATOR™ LITE will  allow you to grow materials in ways which was previously limited in Advanced manufacturing processes, such as inkjet or screen printing, and speed at a fraction of a cost.

 ATLANT 3D's technology allows

• Direct patterned ALD quality level coating
• With possibility to apply up to 450 different commercially available materials
• Highly selective atomic layer patterning
• Excellent 2D/3D conformal deposition on simple and complex surfaces
• Combining multiple materials with excellent compatibility

What makes the NANOFABRICATOR™ LITE unique?

• Perform local, lithography-free material deposition with exceptional precision
• Our integrated CAD software allows you to design, preview, and adjust structures before deposition, streamlining the process from concept to fabrication. Designed as a compact and versatile tool to seamlessly integrate into your lab infrastructure.
• The ability to deposit gradients in geometry, materials, thickness, composition, microstructure and raster and step density. This allows you to do data rich experiments for device design, because you can do material testing in one gradient instead of having to print multiple devices, shortening the R&D time from 2 years to 2 weeks.
• Deposit multiple materials sequentially in the same chamber to create multilayer structures such as Bragg mirrors, MIM capacitors or diodes.
• NANOFABRICATOR™ LITE. Suitable for a wide range of applications such as MEMS and sensors, optics, photonics, advanced packaging, microelectronics as well as emerging applications. 
• 4 different precursors and 4 different reactants can be loaded at the same time, allowing you to quickly switch between the materials you wish to deposit or test.

Features

• LINE WIDTH: 400 µm now, 25 µm in development, 1 µm long term goal
• TEMPERATURE: Operates in a temperature range from room temperature (RT) up to 300°C
• PROCESS SPEED: Variable from 0.1 mm/s up to 100 mm/s (based on sample and process specifications)
• VERSATILE MATERIALS PLATFORM: Possible to process several materials sequentially 
• ENVIRONMENT: Open atmospheric conditions or within controlled ambient environments
• HYBRID PROCESSING: Direct additive and subtractive processing
• SELECTIVE AREA DEPOSITION: Path-defined processing for targeted deposition of materials
• SURFACE GEOMETRY: Conformal deposition on any type of surface with corrugation up to 25 µm
• MULTIMATERIAL STACK PRINTING: Multiple materials can be deposited sequentially
• CRYSTALLINE MATERIAL: Growth High quality material deposition
• SELECTIVE NANOPARTICLE DEPOSITION: Tested with platinum (Pt) processes
• HOLLOW MICROSTRUCTURING: Post process hollow structure development

NANOFABRICATOR™ LITE TECHNICAL SPECIFICATION

Substrate

• Size: up to 4″ (100mm)
• Substrate Handling​: Wafer
• Maximum thickness: 10 mm
• Z direction shape: Flat
• Holding method: Vacuum
• Loading: Manual
• Heater temperature: max. 300°C
• Heater temp. uniformity: +/- 1%

Process Chamber

• Environment: Ambient**** Uncontrolled
• Processing speed*: up to 200 mm/sec
• Deposition area: up to 1.5 mm from wafer edge
• DALP®resolution: 400 μm standard

Gas system

• Precursor temperature: RT – 150°C
• Nr. of precursor bubblers: 2**
• Nr. of reactant bubblers: 1** (H2O***)
• Nr. of gas reactants: 1**

Options

• Environment: Inert***** Controlled
• Additional precursor bubblers: **
• Additional reactant bubblers: **
• Additional gas reactants: **

Footprint: tool size D 100 cm x H 200 cm x W 250 cm

Weight: 400 kg

Power supply 

• 3-phase 32 A
• 3-phase 16 A
• 230 V, 50-60 Hz

Gas line connections

• Argon line connection required
• Nitrogen line connection required
• Oxygen line connection required
• Compressed air line connection required Vacuum line connection required

Exhaust connections

• For electric box
• For gas box For printing unit
• For printhead, should be connected to absorption or decomposition filter (not provided with the system)

* Dependent on materials to be deposited and customer needs.
** Additional number of bubblers and reactants dependent on customer needs.
*** Additional reactant types dependent on customer needs.
**** Clean room, CLASS 8 min recommended.
***** Argon recommended.