Kurt J. Lesker Company: Pushing the boundaries of materials science and device fabrication!

Kurt J. Lesker Company is proud to support cutting-edge research with its atomic layer deposition (ALD) and physical vapor deposition (PVD) cluster tool installations at two leading American institutions:

Penn State University – Atomic Layer Deposition | Materials Research Institute
An integrated ALD cluster tool featuring a plasma-enhanced ALD (PE-ALD) system, ultra-high vacuum (UHV) preparation and deposition chamber, and UHV transfer chamber. This configuration enables researchers to prepare and modify surfaces prior to deposition, with in situ ellipsometry, heat, e-beam evaporation, and reflection high-energy electron diffraction (RHEED) providing real-time control of surfaces and interfaces – accelerating advanced materials research.

Atomic Layer Deposition | PSU Materials Research Institute

New York University – NYU Tandon Nanofab 
A plasma‑enhanced ALD (PE‑ALD) system optimized for device‑quality high‑k dielectrics like HfO₂ and Al₂O₃. As part of a vacuum‑integrated cluster with PVD (e-beam evaporation and sputtering) and ion beam etching (IBE), this system preserves pristine interface quality between deposition and patterning, which is critical for quantum and semiconductor device fabrication.

Atomic Layer Deposition | NYU Tandon Nanofab

Kurt J. Lesker Company is committed to enabling innovation in thin film deposition and next‑generation device development.

Find out more about Kurt J. Lesker Company’s ALD and cluster tool solutions: 
Kurt J. Lesker Company | Atomic Layer Deposition Systems

Kurt J. Lesker Company | OCTOS Automated Thin Film Deposition Cluster Tool | Enabling Technology for a Better World