I can't believe it's not plasma! Forge Nano making catalyzed thermal ALD viable for manufacturing

🔬 Innovative Advances in Atomic Layer Deposition! 🔬

As scientists and engineers push the boundaries of technology to unlock new possibilities, Forge Nano leads the way in Atomic Layer Deposition (ALD) innovation. One significant advancement is plasma-enhanced ALD (PE-ALD), introduced in the 90s to overcome the limitations of thermal ALD by enabling the deposition of materials like titanium nitride (TiN) and tantalum nitride (TaN).

Read the white paper here.

PE-ALD has revolutionized material deposition with its flexibility and enhanced film properties. However, it struggles with high-aspect ratio (HAR) structures, often leading to non-uniform films and decreased yields in semiconductor applications.

Forge Nano challenges the status quo by asking: Is plasma always necessary for low-temperature deposition of hard-to-deposit materials?

Introducing CRISP (Catalyzing Reactions for Induced Surface Process)—Forge Nano's solution for making catalyzed thermal ALD viable in manufacturing. By leveraging clever chemistry and engineering, CRISP uses catalysts like amines to lower activation barriers, enabling high-quality, low-temperature depositions without plasma.

The result? Faster deposition times, lower precursor usage, and superior film properties compared to traditional PE-ALD. Forge Nano's CRISP process for SiO2, for example, offers higher density and breakdown voltage, making it ideal for dielectric and barrier applications.

Forge Nano’s ALDx tools and proprietary Fast Pneumatic Valves (FPVs) make CRISP a game-changer, allowing precise dosing of catalysts and efficient purging, bringing lab innovations to manufacturing scale.

Explore new frontiers of ALD with Forge Nano's CRISP. Contact us to see how this innovative process can transform your workflow. 🌟



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