The Phoenix® system is engineered for high throughput and maximum uptime in any fabrication environment, from pilot production to industrial-grade manufacturing. Technologists and researchers rely on the Phoenix® for repeatable, highly accurate film deposition on flat and 3D substrates alike. And with support for up to six individual precursor lines, the Phoenix® delivers solid, liquid, or gaseous process chemistries depending on your thin film needs. A compact footprint and innovative design makes the Phoenix® the practical choice for those with batch production ALD requirements.

Scientific articles related to the Phoenix ALD system: 

http://manuscript.elsevier.com/S0017931015008418/pdf/S0017931015008418.pdf  

https://iopscience.iop.org/article/10.1149/1.3485279

Key Features:

• Precise software control of process parameters, including temperature, flow and pressure, for defect-free coatings on even the most sensitive substrates
• Patented ALD Shield™ vapor trap to prevent build-up of deposits and minimizes excess process gases from being exhausted into the environment
• Large process chamber accepts GEN 2.5 substrates, multiple wafer cassettes and larger 3D objects
• Low cost of ownership with minimal startup and operational costs
• Compact footprint that conserves valuable clean room space
• Standard recipes and ALD materials readily available
• Comprehensive support and services worldwide from technical team and PhD scientists
• CE, FCC, and CSA compliant with many built-in safety features

Specifications: