Kurt J. Lesker Company
Product model
Type of product
Deposition tool

The Kurt J. Lesker Company® (KJLC®) ALD150LE™ is our most affordable, but extremely flexible Atomic Layer Deposition (ALD) system specifically designed with the entry to mid-level user in mind. The ALD150LE™ is configured for purely thermal ALD, and its unique process chamber design promotes uniform precursor dispersion and delivery. Superior heating and temperature control further enhance system performance. Overall, the ALD150LE™ provides unparalleled flexibility and performance in a compact design without sacrificing serviceability.

Technical features

Process Chamber

  • Purely thermal configuration
  • Perpendicular flow design
  • Two separate chamber inlets for precursor delivery
  • Open-load (up to 150 mm substrates)
  • Independent substrate heater stage


  • Up to 13 precursor sources with two separate chamber inlets
  • Variety of precursor delivery options are available including vapor draw, flow-through and pulsed gas delivery
  • Exposure modes include dynamic, static and Variable Residence Mode™
  • Ozone source

Typical Processes

  • Al2O3, TiO2, SiO2, Ta2O5, HfO2, ZrO2, HZO, ZnO, AZO, AIN, TiN, GaN, Pt, and Ru

System Heating

  • Independent substrate heater stage capable of up to 500°C operation
  • Process chamber and precursor delivery line heating up to 250°C
  • Precursor heating up to 200°C
  • Delivery Line heating up to 250°C
  • Up to 200°C Valve Heating

Process Pump

  • Rotary vane pump (>14 cfm) with foreline purge/vent protection and oil filtration
  • Dry pump
  • Customer supplied process pump

Substrate Transfer

  • Manual loading
  • Glove Box

Software & Controls

  • KJLC® eKLipse™ system control software (LabView based)
  • Real time controller
  • True precision ALD valve timing
Product Links
Kurt J. Lesker Company ALD-150LE™ manufacturer page
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