Atomic Layer Deposition
ALD PRODUCTS
ALD Systems
- Manufacturer
- Kurt J. Lesker Company
- Product model
- ALD-150LE™
- Type of product
- Deposition tool
- Description
The Kurt J. Lesker Company® (KJLC®) ALD150LE™ is our most affordable, but extremely flexible Atomic Layer Deposition (ALD) system specifically designed with the entry to mid-level user in mind. The ALD150LE™ is configured for purely thermal ALD, and its unique process chamber design promotes uniform precursor dispersion and delivery. Superior heating and temperature control further enhance system performance. Overall, the ALD150LE™ provides unparalleled flexibility and performance in a compact design without sacrificing serviceability.
- Technical features
Process Chamber
- Purely thermal configuration
- Perpendicular flow design
- Two separate chamber inlets for precursor delivery
- Open-load (up to 150 mm substrates)
- Independent substrate heater stage
Precursors
- Up to 13 precursor sources with two separate chamber inlets
- Variety of precursor delivery options are available including vapor draw, flow-through and pulsed gas delivery
- Exposure modes include dynamic, static and Variable Residence Mode™
- Ozone source
Typical Processes
- Al2O3, TiO2, SiO2, Ta2O5, HfO2, ZrO2, HZO, ZnO, AZO, AIN, TiN, GaN, Pt, and Ru
System Heating
- Independent substrate heater stage capable of up to 500°C operation
- Process chamber and precursor delivery line heating up to 250°C
- Precursor heating up to 200°C
- Delivery Line heating up to 250°C
- Up to 200°C Valve Heating
Process Pump
- Rotary vane pump (>14 cfm) with foreline purge/vent protection and oil filtration
- Dry pump
- Customer supplied process pump
Substrate Transfer
- Manual loading
- Glove Box
Software & Controls
- KJLC® eKLipse™ system control software (LabView based)
- Real time controller
- True precision ALD valve timing
- Purely thermal configuration
- Product Links
-
Kurt J. Lesker Company ALD-150LE™ manufacturer page
