Atomic Layer Deposition

Atomic Layer Deposition

ALD PRODUCTS

 

Manufacturer
ForgeNano
Product model
THEIA
Type of product
Wafer and object coating
Description
THEIA delivers ultra fast deposition with Forge Nano’s patented SMFD-ALD™ in a low cost system for R&D budgets. Sub-second ALD cycle times allow efficient and rapid exploration of applications requiring thick films. Covering challenging patterned substrates such as advanced-generation DRAM device wafers, membranes, sensors, electron multipliers, etc. with aspect ratios up to 1,000. The flexible chamber design allows for both; round up to 200 mm substrate chuck that fits semiconductor wafers, or square parts carrying tray that better accommodates panels or randomly shaped parts.
Technical features

Capabilities:

  • Fast and thick film deposition ( > 5 micron)
  • Fast ALD deposition at low temperatures
  • Low temperature processing (down to 80 °C)
  • Seamless incorporation of nano-laminates with reproducible atomic-layer control
  • Composite ternary and quaternary alloy films with no throughput penalty
  • In situ QCM monitoring of film growth with high mass and time resolution
  • Field reconfigurable

Specifications:

  • Temperature Window: 50 – 500 °C
  • Liquid Chemical Inlets: Up to 6
  • Gaseous Chemical Inlets: Up to 4
  • Footprint: 60″ L x 32″ W x 76″ H
  • Capacity: Up to 200mm wafers
  • 5mm height clearance for coupons and objects
  • Substrate Handling: Manual single wafer loading
Product Links
ForgeNano THEIA manufacturer page
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