ATLANT3D™ Technology involves the sequential deposition of gases for direct patterning of various coating materials. It uses a micronozzle that sequentially ejects reactive vapors over a moving substrate. So far the following materials have been tested: TiO2, Pt, ZnO, SiO2.

Unique ATLANT3D™ technology allows

- Direct patterned ALD coating using micronozzle
- Rapid atomic layer prototyping and manufacturing
- Highly selective atomic layer patterning
- Excellent 2D/3D conformal deposition on simple and complex surfaces
- Combining multiple materials with excellent compatibility
- Excellent pattern adhesion to almost any surfaces
- Digital and atomically precise control over the printing process
- With possibility to apply up to 450 different commercially available materials

4 different precursors and 4 different reactants can be loaded at the same time, allowing you to quickly switch between the materials you wish to deposit or test

Samples size

•  The stage of NanofabricatorTM 1 can accommodate wafers up to 4’’ and other shapes under 100x100 mm

Stage speed

• The Nanofabricator stage can move up to 100mm/s, with a deposition speed dependent on the sample and process specifications

Footprint 

• tool size D 100 cm x H 200 cm x W 250 cm ******

Weight 

• 400 kg

Power supply 

• 3-phase 32 A
• 3-phase 16 A
• 230 V, 50-60 Hz

Gas line connections

• Argon line connection required
• Nitrogen line connection required
• Oxygen line connection required
• Compressed air line connection required Vacuum line connection required

Exhaust connections

• For electric box
• For gas box For printing unit
• For printhead, should be connected to absorption or decomposition filter (not provided with the system)