ALD Systems

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The Harrier-M™ is a mini batch ALD system for NAND, DRAM and Logic device which has better ALD performance with small volume, narrow gap & wide boat pitch. The better ALD performance with faster pumping/purge ability can provide increased film quality with precision material engineering, excellent step coverage, minimal pattern loading, lower impurity and best wafer to wafer uniformity with compact “5+1” zone heater.
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The Harrier-L™ is Eugene’s new product for batch Thermal & Plasma Enhanced ALD and LPCVD process, provides outstanding mass productivity as compared with established batch system and excellent process solutions with high vacuum conductance design and high thermal control accuracy.
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The BlueJay-e™ : Next generation, compact version offering the same process advantages with a smaller footprint and lower CO2.The BlueJay™: Temperature uniformity control and tunable process gas flow in our multi-chamber, single wafer platform offer unique process flexibility, excellent film thickness uniformity and repeatability, lower thermal budgets and ease of tool matching.
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Thermal ALD processes for batch size up to 100 wafers up to 300 mm
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Supports thermal ALD processes for nano-powders using a rotating reactor approach.
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Supports a wide variety thermal and plasma ALD processes, and plasma CVD processes, on wafers up to 300mm
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Synergis® is a high productivity 300mm tool for a wide range of thermal ALD applications. The Synergis system can be configured with up to four Dual Chamber Modules (DCM), enabling eight chambers in high volume production, within a very compact footprint.
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Pulsar AXIS includes a series of reactor improvements resulting in improved film uniformity, defect performance and wafer-to-wafer repeatability. Additionally the AXIS reactor package enables increased reactor lifetime between clean cycles and improved maintainability in volume production.ALD works by exposing the heated wafer to controlled pulses of process gases. These pulses are each followed by purging. Pulses and purge steps continue in sequence. One complete sequence, called an ALD cycle, forms an atomic layer of the desired material. Multiple layers are formed up to the desired thickness by repeating this cycle.The Pulsar reactor chamber and source delivery system are optimized for precise gas-flow dynamics and minimum purge times that provide advanced process control, film purity and uniformity. Pulsar is designed for gas delivery of solid source precursor materials which have demonstrably better film property performance than liquid precursors.Up to four Pulsar modules can be configured to the XP cluster platform, a member of ASM’s 300mm XP common platform series. Pulsar can also be configured to the Polygon 8300 platform for 300mm wafers, and the Polygon 8200 platform for 200mm and smaller wafers.
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EmerALD XP is a process module designed to deposit thin conformal metal and dielectric ​layers by atomic layer deposition (ALD) used for advanced CMOS gate stacks and other applications.ALD works by exposing the heated wafer to controlled pulses of process gases. These pulses are each followed by purging. Pulses and purge steps take place in sequence. One complete sequence, called an ALD cycle, forms an atomic layer of the desired material. Multiple layers are formed up to the desired thickness by repeating this cycle.The EmerALD reactor chamber uses a showerhead-process gas distribution method to assure uniform gas delivery to the wafer surface. EmerALD also has a remote plasma chamber clean capability which for many processes allows the option of maintaining chamber performance for longer periods between chamber cleans resulting in higher uptime.Up to four EmerALD process modules can be configured to the XP cluster platform, which is a member of ASM’s XP common platform series.
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The optimized design enables ultrafast deposition onto flexible substrates, such as polymer or metal foils.  The system can be configured for thermal or plasma enhanced Spatial ALD to match the desired material to be deposited.  The web width, web speed and deposition materials will be ready to be adopted according to the overall customer application. The standard web-with is ranging from 300 to 2000 mm and a web speed up to 60 m/min. SparkNano uses proven technology used for other high throughput energy applications. Additionally,  optional integrational designs for line integration are offered. 
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Vellum is tailored designed for sheet to sheet (S2S) applications for deposition on substrates ranging from 0,5 x 0,5m up to 1 x 1.5 m. Substrates like metal or polymer foils, wafers, glass and porous substrates. All aimed at real production throughput up to 20 substrates per minute. In combination with a large variety of deposition materials and deposition temperatures.  The substrate flow handling and inline integrated set-up of the system will be in designed as the overall set-up requires.The Vellum product line is a fully automatic processing platform for high throughput.
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The LabLine series are designed for versatility and flexibility and are especially suited for process development and pilot-line production.  Through its unique design, it is possible to accommodate a wide variety of types and sizes of substrates and different materials. The LabLine series is available in two sizes; for maximum 6 inch and for maximum 12 inch substrates . The LabLine series  combines the highest quality Spatial ALD film depositions together with the flexibility of the system to fit future needs and applications. 
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The PICOSUN® R-200 Advanced ALD systems are suitable for R&D on dozens of applications such as IC components, MEMS devices, displays, LEDs, lasers, and 3D objects such as lenses, optics, jewelry, coins, and medical implants.The PICOSUN® R-200 Advanced ALD system is the global market leader in advanced ALD research tools with hundreds of customer installations. It has become the tool of choice both for companies and research institutes driven by innovation.The agile design enables the highest quality ALD film depositions together with the ultimate system flexibility to fit future needs and applications. The patented hot-wall design with fully separate inlets and instrumentation enables particle-free processing adaptable on a wide range of materials on wafers, 3D objects, and all nanoscale features. Excellent uniformity even on the most challenging through-porous, ultra-high aspect ratio, and nanoparticle samples is achieved thanks to our proprietary Picoflow™ technology. The PICOSUN® R-200 Advanced systems are equipped with highly functional and easily exchangeable precursor sources for liquid, gaseous, and solid chemicals. Highly efficient and patented remote plasma option enables deposition of metals without the risk of short-circuiting or plasma damage. Integration with glove boxes, UHV systems, manual and automated loaders, cluster tools, powder chambers, roll-to-roll chambers, and various in situ analytics systems enable efficient and flexible research with good results no matter what your research area is now or might become later on.(*) Plasma generator technical features:Remote plasma source mounted to the loading chamber with connection to the reaction chamberSapphire applicator for different chemistries at superior particle performanceCommercial microwave plasma generator with adjustable 300 – 3000 W power, 2.45 GHz frequencyProtective gas flow in the intermediate space (no back-diffusion of the plasma species)Possibility to plasma and thermal ALD cycling during the same deposition run without hardware changes to the systemFollowing relevant standards were used for evaluation of compliance of the power supply: DIN EN ISO 12100:2011-03, DIN EN 60204-1:2007-06, DIN EN 61000-6-2:2006-03, DIN EN 61000-6-4:2011-09The power supply has been developed and manufactured to meet the requirements stipulated in SEMI S2-0310
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The PICOSUN® R-200 Standard ALD systems are suitable for R&D on dozens of applications such as IC components, MEMS devices, displays, LEDs, lasers, and 3D objects such as lenses, optics, jewelry, coins, and medical implants.The PICOSUN® R-200 Standard ALD system is the market leader in thermal ALD research tools. It has become the tool of choice both for companies and research institutes driven by innovation.The agile design enables the highest quality ALD film depositions together with the ultimate flexibility of the system to fit future needs and applications. The patented hot-wall design with fully separate inlets and instrumentation enables particle-free processing adaptable on a wide range of materials on wafers, 3D objects, and all nanoscale features. Excellent uniformity even on the most challenging through-porous, ultra-high aspect ratio, and nanoparticle samples can be achieved thanks to our proprietary Picoflow™ technology. The PICOSUN® R-200 Standard systems are equipped with highly functional and easily exchangeable precursor sources for liquid, gaseous, and solid chemicals. Integration with glove boxes, powder chambers, and various in situ analytics systems enable efficient and flexible research with good results, no matter what your research area is now, or what it might become later on.
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The PICOSUN® P-1000 ALD system is designed for batch coating of various 3D items such as mechanical machinery parts, glass or metal sheets, coins, watch parts and jewelry, lenses, optics, and medical devices and implants.The PICOSUN® P-1000 ALD system is designed for batch processing of various 3-dimensional items such as mechanical machinery parts, coins, watch parts and jewelry, lenses, optics, and medical equipment, surgical implants and implantable devices (PicoMEDICAL™ solutions) in a production environment. The main applications include various passivation and barrier layers to significantly improve the performance and lifetime of the coated items. The PICOSUN® P-1000 ALD system offers innovative and agile design to enable the highest quality ALD depositions with excellent uniformity, maximum yields, minimum system downtime and low cost-of-ownership with production-proven processes.The reliable, fast, and easy to maintain PICOSUN® P-1000 ALD system represents the cutting-edge of industrial ALD.
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The PICOSUN® P-300B ALD system is specially designed for production of MEMS devices such as print heads, sensors, and microphones, and coating of various 3D items such as mechanical machinery parts, glass or metal sheets, coins, watch parts and jewelry, lenses, optics, and medical devices and implants.The PICOSUN® P-300 ALD systems have become the new standard in high volume ALD manufacturing. By integrating our patented hot-wall design with fully separated inlets, we can create the highest quality ALD films with excellent yield, low particle levels, and superior electrical and optical performance. The agile design with easy and fast maintenance ensures minimum system downtime and lowest cost-of-ownership in the market. Our proprietary Picoflow™ diffusion enhancer technology enables highly conformal coatings on ultra-high aspect ratio substrates with production-proven processes.The PICOSUN® P-300B ALD system is specially designed for batch processing in MEMS and 3-dimensional component production, such as coating of mechanical machinery parts, coins, watch parts and jewelry, lenses, optics, and medical equipment, surgical implants and implantable devices (PicoMEDICAL® solutions). The system is fast, highly reliable and extremely easy to maintain.
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The PICOSUN® P-300BV ALD system is specially designed for production of LEDs, discrete devices, and MEMS devices such as print heads, sensors, and microphones.The PICOSUN® P-300BV ALD system represents the cutting-edge of industrial ALD. The system is designed for semi-automated handling of wafer batches. The tool is optimized for fast batch production and it can be integrated to factory automation via SECS/GEM option. Vacuum loading system with heating option enables clean processing of sensitive substrates and deposition of materials such as metal nitrides.The PICOSUN® P-300BV is the ALD system of choice for innovation driven industries.
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Atomic Layer Deposition (ALD) provides super high-density films that are extremely uniform with exceptional step coverage. The Minilock ALD system has the capability to grow Atomic Layer Deposition films in Thermal and Plasma Enhanced modes (PEALD). It has the industry’s smallest footprint and lowest cost of ownership. The system is available for wafers up to 300mm in diameter. ALD is a thin-film deposition technique based on the sequential use of a gas-phase chemical process and/or plasma processes (PEALD). The majority of ALD reactions use two chemicals called precursors and reactants. The precursor adsorbs onto the surface of the material and the reactant is added thereafter, one at a time in a sequential, self-limiting, manner. By keeping our core components the same, it is very easy to scale to a production cluster platform. Standard processes have been developed for various materials. This is backed by over 25 years’ experience in rapid process development.Contact: Trion Technology info@triontech.com | +1(727)461-1888 | https://triontech.com/contact/request-a-quotation/